Direct-to-Chip (D2C) Cooling System
By removing heat as close as possible to the source, D2C cooling handles far higher heat flux more reliably than cooling many devices individually with air. FRIGUSON develops commercialization-ready D2C systems around four core technology elements.
1. Cold Plate Design & Manufacturing
We optimize microchannel-based flow structures and materials to fabricate the core heat-dissipation component mounted directly on high-heat chipsets.
2. CDU (Coolant Distribution Unit)
We design and build coolant distribution units that compactly integrate pumps, heat exchangers, water-purification filters, and control logic.
3. Final Heat Exchanger & System Design
We select air- or liquid-cooled final heat exchangers and design the entire cooling loop as a single integrated system.
4. Sensors & Control Systems
Thermocouple- and DAQ-based precision temperature measurement, together with flow and pressure control, ensure operational stability and uniform cooling performance.
D2C Integrated System Concept
Heat absorbed by the high-performance Cold Plate is circulated and controlled by the CDU, and ultimately rejected through a final heat exchanger (liquid- or air-cooled). All three elements are linked by an integrated control system to form a complete thermal management solution.
Products
① High-Performance D2C Cold Plate Module
A core heat-dissipation component applying phase-change heat transfer, mounted directly on high-heat chipsets.
② Compact, High-Efficiency CDU
A general-purpose coolant distribution unit compactly integrating pumps, heat exchangers, water-purification filters, and control logic.
③ D2C Integrated Thermal Management Package
A total solution for high-power electronics combining Cold Plate + CDU + final heat exchanger (liquid- or air-cooled).
Commercialization-Ready 5-Stage R&D
From theoretical analysis to commercialization verification, our five-stage, full-cycle R&D process develops commercialization-ready technology to optimally control heat in high-density electronics.
Application Areas
AI & Data Centers
High-efficiency cooling infrastructure for the stable operation of ultra-high-density GPUs and AI research servers, targeting a PUE below 1.1 through dramatically reduced cooling power.
Power Semiconductors
Custom cooling solutions that overcome the thermal-load limits of high-power-density power semiconductor modules.
Future Mobility Electronics
Compact D2C solutions that fit within the limited space of a vehicle, designed for high-power ECUs running autonomous-driving computation.
Considering a technology partnership or adoption?
We help solve cooling challenges in data centers, server manufacturing, power semiconductors, and future mobility electronics.
Get in touch